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3D Printer Heated Bed Power Module High Current 210A MOSFET Upgrade RAMPS 1.4


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  • Mounting holes: 3.2mm diameter, for M3 screws.
  • The distance between holes: 54*43mm
  • Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controllers can handle
  • Voltage: 12V-24V
  • Maximum current with active cooling: 210A

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Product description

Features:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 60*50mm
Mounting holes: 3.2mm diameter, for M3 screws.
The distance between holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controllers can handle
Voltage: 12V-24V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it works stable under I(Max)=25A, the current must not exceed 25A while the process working

Package including:
1 x Heated Bed Power Module
1 x Connection cable for input signal


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